Silicon PIN Photo Diode

HIGH SPEED SENSITIVITY Structure 1.1 Chip Size : 3.00mm X 3.00mm 1.2 Chip thickness : 400±20um 1.3 Metallization : Top - Al, Bottom - Au 1.4 Passivation : Silicon Oxide 1.5 Bonding Pad Size - Anode(top) : 160um X 160um 1.6 Active Area : 2.86mm X 2.86mm

文件：156.29 Kbytes 页数：1 Pages

KODENSHI

可天士

Silicon PIN Photo Diode

Kodenshi-AUK

ZERO VOLTAGE CROSSING OPTICALLY COUPLED TRIAC DRIVERS

文件：109.7 Kbytes 页数：2 Pages

Optek

1x1.25 inch, 3.3 & 5.0 Volt, HCMOS/Sinewave, TCXO

文件：196.69 Kbytes 页数：1 Pages

MTRONPTI

PCIe 3.0, x8 Crypto/ Compression Intel C625 & C626 Server Adapter

Features ƒ Controller supports PCI Express Base Specification 3.0 (8 GTs) ƒ PCI Express x8 lanes ƒ Intel® QuickAssist Technology for Crypto and Compression – Compression/Decompression(Deflate) – RSA Decrypt – IPSec/SSL, up to 40Gbps – Wireless: KASUMI, ZUC, SNOW 3G – Bulk: AES, 3DES, RC4

文件：534.13 Kbytes 页数：1 Pages

ADVANTECH

研华科技