NXV10V160ST1中文资料安森美半导体数据手册PDF规格书

Features

 3 Phase MOSFET Module

 Electrically Isolated DBC Substrate for Low Thermal Resistance

 Temperature Sensing

 Compact Design for Low Total Module Resistance

 Module Serialization for Full Traceability

 AQG324 Qualified and PPAP Capable

 Pb−free, RoHS and UL94V−0 Compliant

Typical Applications

 48V E−Compressor and Other 48 V Auxiliaries

Benefits

 Enable Design of Small, Efficient and Reliable System for Reduced

Vehicle Fuel Consumption and CO2 Emission

 Simplified Vehicle Assembly

 Enable Low Thermal Resistance to Junction−to−Heat Sink by Direct

Mounting via Thermal Interface Material between Module Case and Heat Sink