Molded Chip Wirewound Inductors

FEATURES • EIA SIZES A (1210), B (1812) AND C (1008) • EXCELLENT HIGH Q AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

文件：124.7 Kbytes 页数：13 Pages

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Wirewound Chip Inductors

文件：174.22 Kbytes 页数：9 Pages

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Wirewound Chip Inductors

FEATURES • SIZES K(0402), J (0603), D (0805) AND C (1008) • HIGH Q, HIGH CURRENT AND HIGH SRF CHARACTERISTICS • BOTH FLOW AND REFLOW SOLDERING APPLICABLE* • HIGH INDUCTANCE AVAILABLE IN SMALL SIZE • EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

文件：522.08 Kbytes 页数：6 Pages

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SIZES K(0402), J (0603), D (0805) AND C (1008)

文件：132.55 Kbytes 页数：6 Pages

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