NFA50460R47中文资料Intelligent Power Module, 600V, 4A, SMD数据手册ONSEMI规格书

描述 Description

NFA50460R47 is an advanced Motion SPM 5 Series based on FS4 RC−IGBT technology as a compact inverter solution for small power motor drive applications such as fans and pumps. Embedded six FS4 RC−IGBTs, three half−bridge gate drive HVICs with temperature sensing, and three bootstrap diodes in a compact package fully isolated and optimized for thermal performance. Major features are low Electro−magnetic Interference (EMI) characteristics through optimizing switching speed and reducing parasitic inductance. Since IGBTs are employed as power switches, it provides much more ruggedness and larger Safe Operating Area (SOA) than IGBT based power modules. Right solution for compact and reliable inverter designs where the assembly space is constrained.

特性 Features

• Optimized for over (10) kHz Switching Frequency
• Minimized power loss, Optimized EMI performance
• 600 V FS4 RC−IGBT 3−Phase Inverter with Gate Drivers and Protection
• Breakdown voltage increase up to 600V (SPM5 V1/2/3 500V w.FET)
• Built−In Bootstrap Diodes Simplify PCB Layout
• Simple PCB patterning, Cost optimize with embedded diodes
• Separate Open−Source Pins from Low−Side IGBTs for Three−Phase Current−Sensing
• More flexibity for current sensing
• Optimized for Low Electromagnetic Interference
• Reduce EMI noise level
• HVIC Temperature−Sensing Built−In for Temperature Monitoring
• Increase thermal measurement accuracy
• Active−HIGH Interface, Works with 3.3 / 5 V Logic, Schmitt−trigger Input
• HVIC for Gate Driving and Under−Voltage Protection
• Isolation Rating: 1500 Vrms / Min.
• Moisture Sensitive Level (MSL) 3 for SMD PKG
• Pb−Free and are RoHS CompliantApplicationsPb−Free and are RoHS CompliantApplicationsPb−Free and are RoHS Compliant
• Pb−Free and are RoHS Compliant

应用 Application

• 3-phase inverter
• Fan motor
• Dish washer
• Washing machine
• Pumps

简介

NFA50460R47属于分立半导体产品的功率驱动器模块。由制造生产的NFA50460R47功率驱动器模块功率驱动器模块为电源组件（通常为半桥或单相、两相或三相配置的 IGBT 和 MOSFET）提供物理防护。功率半导体或裸片将焊接或烧结在基材上，后者可承载功率半导体并在需要时提供电和热触点以及电绝缘。功率模块提供更高的功率密度，并且在许多情况下更可靠且更易于冷却。