MXP4005中文资料美高森美数据手册PDF规格书

DESCRIPTION

Microsemi’s InGaAs/InP PIN Photo Diode chips are ideal for high bandwidth 1310nm and 1550nm optical networking applications.

The device series offers superior noise performance and sensitivity due to their planar construction and passivation.

The MXP400X series of photo diodes are currently offered in die form allowing manufacturers the versatility of custom assembly configurations.

This device is ideal for manufacturers of optical receivers, transponders, optical transmission modules and combination PIN photo diode – transimpedance amplifier.

Microsemi will assemble die on submounts and custom configurations.

KEY FEATURES

◾ High Responsivity

◾ Low Dark Current

◾ Extremely Low Capacitance

◾ 12GHz , High Bandwidth

◾ Custom Sub-mounts

◾ Large 40um Bond Pad

APPLICATIONS

◾ 1310nm CATV Optical Applications

◾ 1550nm DWDM Optical Applications

◾ SONET/SDH (FEC), ATM

◾ 10Gigabit Ethernet, Fibre Channel

◾ 10Gbps NRZ or RZ modulation

◾ Optical Test equipment

BENEFITS

◾ Planar passivation

◾ Low Contact Resistance