MUH1PB_V01中文资料威世科技数据手册PDF规格书

FEATURES

• Very low profile - typical height of 0.65 mm

• Ideal for automated placement

• Oxide planar chip junction

• Low forward voltage drop, low power losses

• Ultrafast recovery times for high frequency

• Meets MSL level 1, per J-STD-020C,

LF maximum peak of 260 °C

• AEC-Q101 qualified

• Compliant to RoHS Directive 2002/95/EC and in

accordance to WEEE 2002/96/EC

• Halogen-free according to IEC 61249-2-21 definition

MECHANICAL DATA

Case: MicroSMP

Molding compound meets UL 94 V-0 flammability rating

Base P/N-M3 - halogen-free, RoHS compliant, and

commercial grade

Base P/NHM3 - halogen-free, RoHS compliant, and

automotive grade

Terminals: Matte tin plated leads, solderable per

J-STD-002 and JESD 22-B102

M3 suffix meets JESD 201 class 1A whisker test, HM3 suffix

meets JESD 201 class 2 whisker test

Polarity: Color band denotes the cathode end