MSP3V3_V01中文资料威世科技数据手册PDF规格书

FEATURES

• Very low profile - typical height of 0.65 mm

• Ideal for automated placement

• Oxide planar chip junction

• Unidirectional polarity only

• Peak pulse power: 150 W (10 μs/1000 μs)

• ESD capability: 15 kV (air), 8 kV (contact)

• Meets MSL level 1, per J-STD-020C, LF maximum peak

of 260 °C

• AEC-Q101 qualified

• Not recommended for PCB bottom side wave mounting

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

TYPICAL APPLICATIONS

Use in sensitive electronics protection against voltage

transients induced by inductive load switching and lighting

on ICs, MOSFET, industrial, and signal lines of sensor units

for protecting sensitive equipment against transient

overvoltages.

MECHANICAL DATA

Case: MicroSMP (DO-219AD)

Molding compound meets UL 94 V-0 flammability rating

Base P/N-M3 - halogen-free, RoHS-compliant, and

industrial grade

Base P/NHM3 - halogen-free, RoHS-compliant, and

automotive grade

Terminals: matte tin plated leads, solderable per

J-STD-002 and JESD 22-B102

M3 suffix meets JESD 201 class 2 whisker test, HM3 suffix

meets JESD 201 class 2 whisker test

Polarity: color band denotes the cathode end