SIDE LOOK PACKAGE SOLID STATE LAMP

Description The MSL-824MW, a white source color device, is made with advanced InGaN on SiC chip. The package is mixing epoxy and phosphor within white plastic. Features ● High performance ● Excellent chip to chip consistency ● Uniform radiation pattern Applications ● LCD backlighting ● Sy

文件：30.1 Kbytes 页数：2 Pages

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东贝光电

SIDE LOOK PACKAGE SOLID STATE LAMP

Description The MSL-824SG is designed based on in an industry standard package for ease of handing and use. The package is water clear epoxy within white plastic. Features ● High performance ● Excellent chip to chip consistency ● High reliability Applications ● LCD backlighting ● Symbol b

文件：31.81 Kbytes 页数：2 Pages

UOT

东贝光电

SIDE LOOK PACKAGE SOLID STATE LAMP

Description The MSL-824SO is designed based on in an industry standard package for ease of handing and use. The package is water clear epoxy within white plastic. Features ● High performance ● Excellent chip to chip consistency ● High reliability Applications ● LCD backlighting ● Symbol b

文件：40.59 Kbytes 页数：2 Pages

UOT

东贝光电

SIDE LOOK PACKAGE SOLID STATE LAMP

Description The MSL-824SYG is designed based on in an industry standard package for ease of handing and use. The package is water clear epoxy within white plastic. Features ● High performance ● Excellent chip to chip consistency ● High reliability Applications ● LCD backlighting ● Symbol

文件：35.34 Kbytes 页数：2 Pages

UOT

东贝光电