MPC8544ECVTAQGA数据手册恩XP中文资料规格书

描述 Description

The MPC8544E PowerQUICC® III is designed to offer the unique combination of high performance, exceptional integration and lower overall power consumption required for networking, communications and industrial control applications.
The MPC8544E includes a high-performance e500 processor core built on Power Architecture® technology, enhanced peripherals and high-speed interconnect technology to balance processor performance with I/O system throughput enabling clock speeds scaling from 667 MHz up to 1.067 GHz. Third-generation PowerQUICC III processors are based on NXP®.s 90 nanometer (nm) silicon-on-insulator (SOI) copper interconnect process technology, which is designed to enable the processors to deliver higher performance with lower power dissipation.
The MPC8544E processor offers a wide range of high-speed connectivity options, including Gigabit Ethernet (GbE) interfaces with SGMII support and multiple PCI Express® connections. Support for these high-speed interfaces should enable scalable connectivity to network processors and/or ASICs in the data plane while the PowerQUICC III is designed to handle complex, computationally demanding control plane processing tasks. The MPC8544E is also designed to provide support for legacy PowerQUICC III interfaces such as PCI, I²C, dual universal asynchronous receiver/transmitters (DUART) and local bus connections. These processors are also designed to feature a next-generation double data rate (DDR2) memory controller, enhanced GbE support, v2 e500 double precision floating point and the field proven 90 nm PowerQUICC III integrated security engines.
Key Advantages
High level of integration and performance
Consistent programming model across the PowerQUICC III family
Flexible SoC platform for fast time to market
Simplified board design
Large L2 cache at 256 KB
High internal processing bandwidth
Integrated DDR and DDR2 memory controller
Two integrated Ethernet controllers (enhanced TSEC) with SGMII support
Large L2 cache at 256 KB
Flexible high-speed interconnection interfaces/multiple PCI Express connections
32-bit PCI support
Integrated security engine
Access to the errata document for this device requires an NDA. Contact your local NXP Sales Office or NXP Authorized Distributor.

特性 Features

• Embedded e500 core, initial offerings from 667 MHz up to 1.067 GHz
• Dual dispatch superscalar, 7-stage pipeline design with out-of-order issue and execution
• 2,240 MIPS at 1.0 GHz (estimated Dhrystone 2.1)
• 36-bit physical addressing
• Integrated L1/L2 cache
• L1 cache—32 KB data and 32 KB instruction cache with line-locking support
• L2 cache—256 KB (8-way set associative); 256/128/64/32 KB can be used as SRAM
• L1 and L2 hardware coherency
• L2 cache and I/O transactions can be stashed into L2 cache regions
• Integrated DDR memory controller with full ECC support, offering:
• 200 MHz clock rate (400 MHz data rate), 64-bit, 2.5V/2.6V I/O, DDR SDRAM
• 267 MHz clock rate (up to 533 MHz data rate), 64-bit, 1.8V I/O, DDR2 SDRAM
• Integrated security engine supporting DES, 3DES, MD-5, SHA-1/2, AES, RSA, RNG, Kasumi F8/F9 and ARC-4 encryption algorithms (MPC8544E)
• Two on-chip enhanced triple speed Ethernet controllers (ETSECs) supporting 10 Mbps, 100 Mbps and 1 Gbps Ethernet/IEEE® 802.3 networks with MII, RMII, GMII, RGMII TBI and RTBI physical interfaces as well as SGMII interfaces through a dedicated SerDes.
• TCP/UDP/IP checksum acceleration
• Advanced QoS features
• Enhanced hardware and software debug support
• Double-precision embedded scalar and vector floating-point APUs
• Memory management unit (MMU)
• PCI Express high-speed interconnect interfaces, supporting combinations of dual x4 and single x1 PCI Express
• On-chip network switch fabric
• PCI interface support
• 32-bit PCI 2.2 bus controller (up to 66 MHz, 3.3V I/O)
• Local bus
• 133 MHz, 32-bit, 3.3V I/O, local bus with memory controller
• Integrated four-channel DMA controller
• Dual I²C and DUART support
• Programmable interrupt controller (PIC)
• IEEE 1149.1 JTAG test access port
• 1.0V core voltage with 3.3V and 2.5V I/O
• 783-pin FC-PBGA package
• Operating junction temperature range: TJ = 0º to +105ºC, Extended temperature range: TJ = -40º to +105ºC
• This product is included in NXP®.s product longevity program, with assured supply for a minimum of 10 years after launch

应用 Application

Secure Transaction and Retail Payments
•POS Printer