PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications

文件：616.89 Kbytes 页数：102 Pages

freescaleFreescale Semiconductor, Inc

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PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications

文件：612.19 Kbytes 页数：102 Pages

freescaleFreescale Semiconductor, Inc

飞思卡尔飞思卡尔半导体

PowerQUICC, 32 Bit Power Arch SoC, 533MHz, DDR1/2, PCI, 1GbE, USB, TDM, ATM, -40 to 105C, Rev 1

Our MPC8360E PowerQUICC® II Pro family of integrated communications processors is a next-generation extension of the popular PowerQUICC II line containing cores built on Power Architecture® technology. The MPC8360E family incorporates a next-generation communications engine, the QUICC Engine®. suppo • e300 core operating from 266 MHz to 667 MHz • 32-bit, high-performance superscalar core\n• 1,261 MIPS at 667 MHz; 503 MIPS at 266 MHz\n• Double-precision floating point, integer, load/store, system register branch processor units and 32 KB data and 32 KB instruction cache with line-locking support;

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PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications

文件：612.19 Kbytes 页数：102 Pages

freescaleFreescale Semiconductor, Inc

飞思卡尔飞思卡尔半导体

PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications

文件：612.19 Kbytes 页数：102 Pages

freescaleFreescale Semiconductor, Inc

飞思卡尔飞思卡尔半导体

PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications

文件：612.19 Kbytes 页数：102 Pages

freescaleFreescale Semiconductor, Inc

飞思卡尔飞思卡尔半导体