MPC8260AZUPJDB

POWERQUICC II HIP4 REV B; System core microprocessor supporting frequencies of 133-300 MHz\n• 190 MIPS at 100 MHz (Dhrystone 2.1)\n• 505 MIPS at 266 MHz (Dhrystone 2.1)\n• 570 MIPS at 300 MHz (Dhrystone 2.1)\n• High-performance, superscalar microprocessor\n• Disable CPU mode\n• Supports the NXP® external L2 cache chip (MPC2605)\n• Improved low-power core\n• 16 Kbyte data and 16 Kbyte instruction cache, four-way set associative\n• Memory Management Unit\n• Floating point unit enabled\n• Common on-chip processor (COP)\n• System Integration Unit (SIU)• Memory Controller, including two dedicated SDRAM machines\n• PCI up to 66 MHz (available in subsequent versions)\n• Hardware bus monitor and software watchdog timer\n• IEEE 1149.1 JTAG test access port\n• High-Performance Communications Processor Module (CPM) with operating frequencyup to 133, 166, or 200 MHz• G2 core and CPM may run at different frequencies\n• Parallel I/0 Registers\n• On-board 32 KBytes of dual-port RAM\n• Two multi-channel controllers (MCCs) each supporting 128 full-duplex,64 Kbps, HDLC lines\n• Virtual DMA Functionality\n• Three FCCs supporting:• Up to 155 Mbps ATM SAR (maximum of two) (AAL0, AAL1, AAL2, AAL5)\n• 10/100 Mbps Ethernet (up to three) (IEEE 802.3X with Flow Control)\n• 45 Mbps HDLC/Transparent (up to three)\n• Two bus architectures: one 64-bit 60x bus and one 32-bit PCI or local bus\n• Two UTOPIA level-2 master/slave ports, both with multi-PHY support.\n• Three MII Interfaces\n• Eight TDM interfaces (T1/E1), two TDM ports can be glueless to T3/E3\n• 1.8V or 2.0V internal and 3.3V I/O\n• 300 MHz power consumption: 2.5 W\n• 480 TBGA package (37.5 mm x 37.5 mm)\n;

The MPC8260 PowerQUICC® II™ is an advanced integrated communications processor designed for the telecommunications and networking markets.\nThe MPC8260 now offers floating point support.\nThe MPC8260 PowerQUICC II can best be described as the next generation MPC860 PowerQUICC®, providing higher performance in all areas of device operation, including greater flexibility, extended capabilities, and higher integration.\nLike the MPC860, the MPC8260 integrates two main components, the embedded G2 core and the Communications Processor Module (CPM). This dual-processor architecture consumes less power than traditional architectures because the CPM offloads peripheral tasks from the embedded G2 core. The CPM simultaneously supports three fast serial communications controllers (FCCs), two multichannel controllers (MCCs), four serial communications controllers (SCCs), two serial management controllers (SMCs), one serial peripheral interface (SPI) and one I2C interface. The combination of the G2 core and the CPM, along with the versatility and performance of the MPC8260, provides customers with enormous potential in developing networking and communications products while significantly reducing time-to-market development stages.\n

恩XP

MPC8260CVR

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MPC8260CZU

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MPC8260EC

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MPC8260VR

MPC826xA(HiP4)FamilyHardwareSpecifications

MPC8260ZU

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NI8260

PXIExpressIn-ChassisDataStreamingModule

PC8260

PowerPC-basedCommunicationsProcessors

Description ThePC8260PowerQUICCII™isaversatilecommunicationsprocessorthatintegratesononechip,ahigh-performancePowerPC(PC603e)RISCmicroprocessor,ahighlyflexiblesystemintegrationunit,andmanycommunicationsperipheralcontrollersthatcanbeusedinavarietyofapplicatio

PN8260

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PPC-MB-8260AE

M/BofferingforPPC-61X1C-RTAE

Features ƒSupportsIntel®6th&7thGenCore™iprocessor(LGA1151)withIntelH110 chipset ƒOne260-pinSO-DIMMupto16GBDDR42133MHzSDRAM ƒSupportstripledisplayofDP/VGA/LVDS ƒSupports1F/SminiPCIeormSATA,4USB3.0and2USB2.0 ƒSupports1PCIEx4(Gen3) ƒSupports2SATA