MOC208中文资料摩托罗拉数据手册PDF规格书

These devices consist of a gallium arsenide infrared emitting diode optically coupled to a monolithic silicon phototransistor detector, in a surface mountable, small outline, plastic package. They are ideally suited for high density applications, and eliminate the need for through–the–board mounting.

• Convenient Plastic SOIC–8 Surface Mountable Package Style

• Closely Matched Current Transfer Ratios

• Minimum V(BR)CEO of 70 Volts Guaranteed

• Standard SOIC–8 Footprint, with 0.050″ Lead Spacing

• Shipped in Tape and Reel, which Conforms to EIA Standard RS481A

• Compatible with Dual Wave, Vapor Phase and IR Reflow Soldering

• High Input–Output Isolation of 3000 Vac (rms) Guaranteed

• UL Recognized File #E54915

Applications:

• Feedback Control Circuits

• Interfacing and coupling systems of different potentials and impedances

• General Purpose Switching Circuits

• Monitor and Detection Circuits