首页 >MMCM2222>规格书列表
| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
DUALNPNSMALLSIGNALSURFACEMOUNTTRANSISTOR Features EpitaxialPlanarDieConstruction ComplementaryPNPTypeAvailable(MMDT2907A) Ultra-SmallSurfaceMountPackage | TRSYS Transys Electronics | TRSYS | ||
DUALNPNSMALLSIGNALSURFACEMOUNTTRANSISTOR Features •BVCEO>40V •EpitaxialPlanarDieConstruction •IdealforMediumPowerAmplificationandSwitching •Ultra-SmallSurfaceMountPackage •ComplementaryPNPType:MMDT2907A •TotallyLead-Free&FullyRoHSCompliant(Notes1&2) •HalogenandAntimonyFree.“Green”Devic | DIODESDiodes Incorporated 美台半导体 | DIODES | ||
DUALNPNSMALLSIGNALSURFACEMOUNTTRANSISTOR | DIODESDiodes Incorporated 美台半导体 | DIODES | ||
DUALSURFACEMOUNTNPNTRANSISTORS DUALSURFACEMOUNTNPNTRANSISTORS Thisdevicecontainstwoelectrically-isolated2N2222ANPNtransistors. ThetwotransistorshavewellmatchedhFEandareencapsulatedinanultra-smallSOT-363(SC70-6L)package.Thisdeviceisidealforportableapplicationswhereboardspaceisatapremiu | PANJITPan Jit International Inc. 強茂強茂股份有限公司 | PANJIT | ||
DualNPNSmallSignalSurfaceMountTransistor FEATURES •Epitaxialplanardieconstruction. •ComplementaryPNPtypeavailableMMDT2907A. •Ultra-smallsurfacemountpackage. APPLICATIONS •DualNPNsmallsignalsurfacemounttransistor | BILINGalaxy Semi-Conductor Holdings Limited 银河微电常州银河世纪微电子股份有限公司 | BILIN | ||
DUALNPNSMALLSIGNALSURFACEMOUNTTRANSISTOR Features •EpitaxialPlanarDieConstruction •ComplementaryPNPTypeAvailable(MMDT2907A) •LeadFree/RoHSCompliant(Note2) •GreenDevice(Note3and4) | DIODESDiodes Incorporated 美台半导体 | DIODES | ||
Multi-ChipTransistor Features Powerdissipation PCM:0.15W(Tamp.=25°C) Collectorcurrent ICM:0.6A Collector-basevoltage V(BR)CBO:75V Operating&StoragejunctionTemperature Tj,Tstg:-55°C~+150°C | SECOSSeCoS Halbleitertechnologie GmbH 喜可士喜可士股份有限公司 | SECOS | ||
NPNPlastic-EncapsulateTransistors Features •Halogenfreeavailableuponrequestbyaddingsuffix-HF •LeadFreeFinish/RoHSCompliant(PSuffixdesignates RoHSCompliant.Seeorderinginformation) •EpitaxialDieConstruction •SmallSurfaceMountPackage •Marking:K1P •EpoxymeetsUL94V-0flammabilityrating •Moi | MCCMicro Commercial Components 美微科美微科半导体股份有限公司 | MCC | ||
NPNPlastic-EncapsulateTransistors | MCCMicro Commercial Components 美微科美微科半导体股份有限公司 | MCC | ||
DualNPNSmallSignalSurfaceMountTransistor | BILINGalaxy Semi-Conductor Holdings Limited 银河微电常州银河世纪微电子股份有限公司 | BILIN |
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