MLG1608B39NST技术资料参数原装现货东电化-114ic电子网

型号	下载订购	功能描述	制造商上传企业	LOGO
MLG1608B39NST	文件：36.5 Kbytes Page：2 Pages	For High Frequency SMD Overview of the MLG Series FEATURES Advanced monolithic structure is formed using a multilayering and sintering process with ceramic and conductive materials for High frequency. APPLICATION Automotive equipment, smart phones, tablet terminals, high frequency modules (PAs, VCOs, FEMs , 文件：36.5 Kbytes 页数：2 Pages	TDK 东电化	TDK
MLG1608B39NDT	文件：36.5 Kbytes Page：2 Pages	For High Frequency SMD Overview of the MLG Series FEATURES Advanced monolithic structure is formed using a multilayering and sintering process with ceramic and conductive materials for High frequency. APPLICATION Automotive equipment, smart phones, tablet terminals, high frequency modules (PAs, VCOs, FEMs , 文件：36.5 Kbytes 页数：2 Pages	TDK 东电化	TDK
MLG1608B39NJT	文件：58.25 Kbytes Page：4 Pages	SMD Inductors(Coils) For High Frequency(Multilayer) 文件：58.25 Kbytes 页数：4 Pages	TDK 东电化	TDK
MLG1608B39NJT	文件：36.5 Kbytes Page：2 Pages	For High Frequency SMD Overview of the MLG Series FEATURES Advanced monolithic structure is formed using a multilayering and sintering process with ceramic and conductive materials for High frequency. APPLICATION Automotive equipment, smart phones, tablet terminals, high frequency modules (PAs, VCOs, FEMs , 文件：36.5 Kbytes 页数：2 Pages	TDK 东电化	TDK

更多MLG1608B39NST供应商更新时间2025-11-29 14:32:00