MLF中文资料安靠科技数据手册PDF规格书

Applications

The small size and weight along with excellent thermal and elec trical performance make the MicroLeadFrame® package an ideal choice for handheld portable applications such as smartphones and tablets or any other application where size, weight and package performance are required.

特性 Features

Small size (reduce package footprint by 50% or more and improved RF performance) and weight

Standard leadframe process flow and equipment

Excellent thermal and electrical performance

0.35 mm to 1.45 mm maximum height

I/O count range: 1-180 available with conventional MLF®; >200 possible with rtMLF®

1-13 mm body size

Thin profile and superior die-to-body size ratio

Pb-free/Green

Flexible designs and high yields

Saw and punch versions available