MK10DN512VMD10中文资料数据手册PDF规格书

特性 Features

• Operating Characteristics

– Voltage range: 1.71 to 3.6 V

– Flash write voltage range: 1.71 to 3.6 V

– Temperature range (ambient): -40 to 105°C

• Performance

– Up to 100 MHz ARM Cortex-M4 core with DSP instructions delivering 1.25 Dhrystone MIPS per MHz

• Memories and memory interfaces

– Up to 512 KB program flash memory on nonFlexMemory devices

– Up to 256 KB program flash memory on FlexMemory devices

– Up to 256 KB FlexNVM on FlexMemory devices

– 4 KB FlexRAM on FlexMemory devices

– Up to 128 KB RAM

– Serial programming interface (EzPort)

– FlexBus external bus interface

• Clocks

– 3 to 32 MHz crystal oscillator

– 32 kHz crystal oscillator

– Multi-purpose clock generator

• System peripherals

– Multiple low-power modes to provide power optimization based on application requirements

– Memory protection unit with multi-master protection

– 16-channel DMA controller, supporting up to 63 request sources

– External watchdog monitor

– Software watchdog

– Low-leakage wakeup unit

• Security and integrity modules

– Hardware CRC module to support fast cyclic redundancy checks

– 128-bit unique identification (ID) number per chip

• Human-machine interface

– Low-power hardware touch sensor interface (TSI)

– General-purpose input/output

• Analog modules

– Two 16-bit SAR ADCs

– Programmable gain amplifier (PGA) (up to x64) integrated into each ADC

– Two 12-bit DACs

– Two transimpedance amplifiers

– Three analog comparators (CMP) containing a 6-bit DAC and programmable reference input

– Voltage reference

• Timers

– Programmable delay block

– Eight-channel motor control/general purpose/PWM timer

– Two 2-channel quadrature decoder/general purpose timers

– Periodic interrupt timers

– 16-bit low-power timer

– Carrier modulator transmitter

– Real-time clock

• Communication interfaces

– Two Controller Area Network (CAN) modules

– Three SPI modules

– Two I2C modules

– Six UART modules

– Secure Digital host controller (SDHC)

– I2S module