恩XP ARM® Cortex®-A9 i.MX6 SMARC v1.1 Module

Features ƒ 恩XP ARM® Cortex® -A9 i.MX6 high performance processor ƒ Onbard DDR3 memory and eMMC 16GB ƒ Parallel RGB, HDMI, single channel 18/24-bit LVDS, 1366 x 768 ƒ 2 x CAN, 4 x UART, 5 x I2C, 12 x GPIO, 1 x PCIe, 1 x camera input and 1 x Gigabit LAN ƒ Supports OpenGL ES 2.0 and OpenVG 1.1

文件：3.10378 Mbytes 页数：4 Pages

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恩XP i.MX6 Cortex-A9 RISC Embedded Mini-ITX Box Computer

Features ƒ 恩XP ARM Cortex-A9 i.MX6 Dual/Quad 1GHz high performance processor ƒ On board DDR3 1066MHz 1GB/2GB memory and 8GB EMMC NAND flash ƒ Supports Dual Display: VGA/HDMI ƒ Supports 1 x mini-PCIe, 4 x serial ports, 6 x USB, 1 x M.2 socket,8 x GPIO, 1 x CAN ƒ Low power consumption, fanless

文件：3.18839 Mbytes 页数：4 Pages

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恩XP ARM® Cortex®-A9 i.MX6 Dual/Quad Mini-ITX Motherboard

Features ƒ 恩XP ARM® Cortex®-A9 i.MX6 Dual/Quad 1GHz high performance processor ƒ On board DDR3 1066MHz 1GB/2GB memory and 8GB EMMC NAND flash ƒ Supports Triple Display: VGA/HDMI/LVDS ƒ Supports 1 x PCIe, 1 x mini-PCIe, 5 x serial ports, 6 x USB, 1 x M.2 socket, 18 x GPIO, 1 x CAN ƒ Low power

文件：3.14663 Mbytes 页数：4 Pages

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Intel Atom E3900 series Embedded SBC Fanless Slim System

Features ƒ Intel® Atom™ E3900 series ƒ Onboard 4GB LPDDR4-2400MT/s, 32GB eMMC ƒ Independent display by HDMI ƒ Semi-Industry Fanless slim systen, Din Rail or Wall mount design ƒ Support HDMI x 1 , GbE x 2 USB 3.0 x 2, COM x 2, DIO x 2 ƒ Flexible expansion M.2 E key, F/S miniPCIe ƒ 12V power

文件：1.81659 Mbytes 页数：6 Pages

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Intel® Atom™ E3900 / Pentium® / Celeron® N Series SMARC Module

Features ƒ SMARC2.0 & SMARC2.1 Compliance ƒ Intel® Atom™ E3900 / Pentium® / Celeron® N Series Processors ƒ Integrated dual GbE. wireless module on board design ƒ Dual channel LPDDR4 2/4/8 GB memory down & onboard eMMC ƒ Triple display (DP++, HDMI, LVDS) ƒ Supports iManager, WISE-PaaS/DeviceO

文件：9.17742 Mbytes 页数：6 Pages

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11th Gen. Intel® Core™ i7/i5/i3/Celeron U-Series 3.5 SBC w/ MIOe

Features ƒ 11th Gen. Intel® Core™ Processor with Quad/Dual Cores, TDP 15W/ 28W ƒ Dual Channel DDR4-3200 up to 64GB ƒ 4 simultaneous displays: LVDS/HDMI/DP/USB Type-C, eDP (optional) ƒ 2 GbE, 4 USB3.2, CAN Bus, DC-in 12-24V ƒ Expansion: M.2 E-Key/B-Key/M-Key (supports NVMe), MIOe ƒ Supports i

文件：5.52344 Mbytes 页数：6 Pages

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Intel® Pentium®/Celeron® and Atom® x6000 Series Processors (Code Name: Elkhart Lake) COM Express® Compact Type6

Features ƒ COM Express® R3.0 Compact Module Type 6 Pinout ƒ Intel® Pentium®/Celeron® and Atom® x6000 Series (Elkhart Lake) Processors ƒ Dual Channel up to 32GB DDR4-3200 and IBECC Supported by Specific SKUs ƒ Supports up to 3 simultaneous display: LVDS/eDP, HDMI/DisplayPort ƒ Supports onboar

文件：1.24826 Mbytes 页数：6 Pages

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9th/8th Gen. Intel Xeon /Core™ Processor, 3.5 SBC w/ MIOe

Features ƒ 9th/8th Gen. Intel® Xeon®/Core™ Processor, up to 6 cores, and TDP 45W/25W ƒ Dual channel DDR4-2400, up to 64GB*, ECC for Xeon SKU ƒ Triple simultaneous displays with 48-bit LVDS+HDMI+DP ƒ USB 3.1 Gen2 (10 Gbps), TPM 2.0 & NVMe/PCIe Gen3x4 SSD ƒ Dual GbE, SATAIII, RS-232/422/485, CA

文件：1.8667 Mbytes 页数：6 Pages

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AMD Embedded Ryzen V2000 COM Express® Compact Type 6

Features ƒ AMD Embedded Ryzen 7nm SoC – V2000 APU ƒ COM Express® R3.0 Compact Module Type 6 Pinout ƒ Dual Channel DDR4 SODIMM, max. 64GB (Both ECC & Non-ECC) ƒ High Speed I/Os: 2 USB 3.2 Gen2, 1 PCIe x8 Gen3, 8 PCIe x1 Gen3, and 2 SATA3.0 ƒ Four Display (DP++, HDMI, VGA, LVDS) ƒ Supports iM

文件：4.18813 Mbytes 页数：6 Pages

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Intel® Xeon® D-2700 Processor (Ice Lake-D HCC) COM-HPC® Server Size D

Features ƒ COM-HPC® Server Size D Module ƒ Intel® Xeon® D-2700 processors (Ice Lake-D HCC) ƒ Up to 20 Cores, 30MB LLC Cache, 118W TDP ƒ Quad channel DDR4-3200 RDIMM/LRDIMM up to 512GB (Both ECC & Non-ECC) ƒ 32 x PCIe Gen 4, 17 x PCIe Gen 3, 4 x 25GBASE-KR, IPMB ƒ Supports iManager, Embedded

文件：4.17383 Mbytes 页数：6 Pages

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