包装：散装 功能：LED 阵列 类别：开发板，套件，编程器 评估板 - 扩展板，子卡 描述：DISPLAY BOARD 8X8 GREEN CLICK

mikroElektronika

TMOS POWER FET 75 AMPERES

The D2PAK package has the capability of housing a larger die than any existing surface mount package which allows it to be used in applications that require the use of surface mount components with higher power and lower RDS(on) capabilities. This advanced high–cell density HDTMOS power FET is des

文件：176.55 Kbytes 页数：8 Pages

Motorola

摩托罗拉

N?묬hannel Power MOSFET

文件：216.91 Kbytes 页数：9 Pages

ONSEMI

安森美半导体

200 V - 1,000 V Single Phase Bridge

[VOLTAGE MULTIPLIERS INC.] 200 V - 1,000 V Single Phase Bridge 4.5 A - 5.0 A Forward Current 70 ns - 3000 ns Recovery Time

文件：138.98 Kbytes 页数：2 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

200 V - 1,000 V Single Phase Bridge 4.5 A - 5.0 A Forward Current 70 ns - 3000 ns Recovery Time

200 V - 1,000 V Single Phase Bridge 4.5 A - 5.0 A Forward Current 70 ns - 3000 ns Recovery Time

文件：142.48 Kbytes 页数：2 Pages

VMI

POLYESTER (MYLAR) and FOIL

EFC Series 1306 are polyester and foil capacitors. This series offers the advantage of small size and low cost, dv/dt ratings in excess of 1000 V/µs. Suggested applications include: medical electronics, telecommunications. Packaging options include: wrap and fill (TF, TC), radial lead box (EFR), a

文件：58.32 Kbytes 页数：9 Pages

EFC