MH32S72BBFA-8中文资料三菱电机数据手册PDF规格书

DESCRIPTION

The MH32S72BBFA is 33554432 - word x 72-bit Sy nchronous DRAM stacked structural module. This consist of thirty -six industry standard 16M x 4 Sy nchronous DRAMs in TSOP.

The stacked structure of TSOP on a card edge dual inline package prov ides any application where high densities and large of quantities memory are required.

This is a socket-ty pe memory module ,suitable f or easy interchange or addition of module.

FEATURES

• Utilizes industrystandard 16M X 4 Synchronous DRAMs in TSOP package , industry standard Resister in TSSOP package , and industry standard PLL in TSSOP package.

• Single 3.3V +/- 0.3V supply

• Burst length 1/2/4/8/Full Page (programmable)

• Burst type sequential / interleave (programmable)

• Column access random

• Burst W rite / Single W rite (programmable)

• Auto precharge / Auto bank precharge controlled by A10

• Auto refresh and Self refresh

• LVTTL Interface

• 4096 refresh cycles every 64ms

• Intel specifiation(rev. 1.2)compliant PCB and SPD 1.2A

APPLICATION

Main memory unit for computers, Microcomputer memory.