MF-MSMF110SLASH33X中文资料伯恩斯数据手册PDF规格书

特性 Features

n Standard 1812 footprint

n Fast Time-to-Trip (TTT) to protect against

overcurrent events

n Excellent solderability with ENIG terminal

n Symmetrical designs and low profile

n RoHS compliant* and halogen free**

n Agency recognition:

n TÜV approval to the following standards:

IEC 62319-1, IEC 60738-1 and

IEC 60730-1:2013 clause 15, clause 17

and Annex J