MF-LSMF185SLASH33X中文资料伯恩斯数据手册PDF规格书

特性 Features

n Standard 2920 footprint

n Swift Time-to-Trip (TTT) for safeguarding

against overcurrent events

n Excellent solderability with ENIG terminal

n Symmetric designs and low profile

n RoHS compliant* and halogen free**

n High power rating and high voltage

n Agency recognition:

n TÜV certifications cover IEC 62319-1,

IEC 60738-1, and IEC 60730-1:2013,

encompassing clause 15, clause 17, and

Annex J.