MCXNX4X中文资料恩智浦数据手册PDF规格书

Features

•Dual Arm® Cortex®-M33 150 MHz with 618 CoreMark® (4.12 CoreMark/MHz) for each core

•4.8 GOPs edge AI/ML acceleration with NPU

•Platform Security with EdgeLock® Secure Enclave, Core Profile.

•-40 °C to +125 °C temperature range.

•Down to 57 μA/MHz active current, 6 μA Power down mode with RTCenabled and 512 KB SRAM retention, 2 μA Deep Power-down modewith RTC active and 32 KB SRAM.