丝印：MCXN235VDFT；Arm® Cortex®-M33 150MHz 32-bit MCU, up to 1MB Flash

Features[1] • Arm Cortex-M33 150MHz with 618 CoreMark® (4.12 CoreMark/MHz) • Up to 1MB Flash, 352 KB SRAM • Platform Security with EdgeLock® Secure Enclave, Core Profile • - 40 °C to + 125 °C temperature range • Down to 50 μA/MHz active current, 3.0 μA Power down mode with RTC enabled and 35

文件：1.97979 Mbytes 页数：102 Pages

恩XP

丝印：MCXN235VDFT；Arm® Cortex®-M33 150MHz 32-bit MCU, up to 1MB Flash

Features[1] • Arm Cortex-M33 150MHz with 618 CoreMark® (4.12 CoreMark/MHz) • Up to 1MB Flash, 352 KB SRAM • Platform Security with EdgeLock® Secure Enclave, Core Profile • - 40 °C to + 125 °C temperature range • Down to 50 μA/MHz active current, 3.0 μA Power down mode with RTC enabled and 35

文件：1.97979 Mbytes 页数：102 Pages

恩XP

丝印：MCXN235VDFT；Arm® Cortex®-M33 150MHz 32-bit MCU, up to 1MB Flash

Features[1] • Arm Cortex-M33 150MHz with 618 CoreMark® (4.12 CoreMark/MHz) • Up to 1MB Flash, 352 KB SRAM • Platform Security with EdgeLock® Secure Enclave, Core Profile • - 40 °C to + 125 °C temperature range • Down to 50 μA/MHz active current, 3.0 μA Power down mode with RTC enabled and 35

文件：1.97979 Mbytes 页数：102 Pages

恩XP

丝印：MCXN235VDFT；Arm® Cortex®-M33 150MHz 32-bit MCU, up to 1MB Flash

Features[1] • Arm Cortex-M33 150MHz with 618 CoreMark® (4.12 CoreMark/MHz) • Up to 1MB Flash, 352 KB SRAM • Platform Security with EdgeLock® Secure Enclave, Core Profile • - 40 °C to + 125 °C temperature range • Down to 50 μA/MHz active current, 3.0 μA Power down mode with RTC enabled and 35

文件：1.97979 Mbytes 页数：102 Pages

恩XP

丝印：MCXN235VDFT；Arm® Cortex®-M33 150MHz 32-bit MCU, up to 1MB Flash

Features[1] • Arm Cortex-M33 150MHz with 618 CoreMark® (4.12 CoreMark/MHz) • Up to 1MB Flash, 352 KB SRAM • Platform Security with EdgeLock® Secure Enclave, Core Profile • - 40 °C to + 125 °C temperature range • Down to 50 μA/MHz active current, 3.0 μA Power down mode with RTC enabled and 35

文件：1.97979 Mbytes 页数：102 Pages

恩XP

丝印：MCXN235VDFT；Arm® Cortex®-M33 150MHz 32-bit MCU, up to 1MB Flash

Features[1] • Arm Cortex-M33 150MHz with 618 CoreMark® (4.12 CoreMark/MHz) • Up to 1MB Flash, 352 KB SRAM • Platform Security with EdgeLock® Secure Enclave, Core Profile • - 40 °C to + 125 °C temperature range • Down to 50 μA/MHz active current, 3.0 μA Power down mode with RTC enabled and 35

文件：1.97979 Mbytes 页数：102 Pages

恩XP

丝印：MCXN235VDFT；Arm® Cortex®-M33 150MHz 32-bit MCU, up to 1MB Flash

Features[1] • Arm Cortex-M33 150MHz with 618 CoreMark® (4.12 CoreMark/MHz) • Up to 1MB Flash, 352 KB SRAM • Platform Security with EdgeLock® Secure Enclave, Core Profile • - 40 °C to + 125 °C temperature range • Down to 50 μA/MHz active current, 3.0 μA Power down mode with RTC enabled and 35

文件：1.97979 Mbytes 页数：102 Pages

恩XP

丝印：MCXN235VDFT；Arm® Cortex®-M33 150MHz 32-bit MCU, up to 1MB Flash

Features[1] • Arm Cortex-M33 150MHz with 618 CoreMark® (4.12 CoreMark/MHz) • Up to 1MB Flash, 352 KB SRAM • Platform Security with EdgeLock® Secure Enclave, Core Profile • - 40 °C to + 125 °C temperature range • Down to 50 μA/MHz active current, 3.0 μA Power down mode with RTC enabled and 35

文件：1.97979 Mbytes 页数：102 Pages

恩XP

丝印：MCXN235V；Package：VFBGA；Arm® Cortex®-M33 150MHz 32-bit MCU, up to 1MB Flash

Features •Arm Cortex-M33 150MHz with 618 CoreMark® (4.12 CoreMark/MHz) •Up to 1MB Flash, 352 KB SRAM •Platform Security with EdgeLock® Secure Enclave, Core Profile •- 40 °C to + 125 °C temperature range •Down to 50 μA/MHz active current, 3.0 μA Power down mode with RTC enabled and 352 KB SRAM

文件：3.32133 Mbytes 页数：105 Pages

恩XP