MCXA143VFT中文资料数据手册PDF规格书

32-bit Arm Cortex®-M33 MCU for Industrial and Consumer IoT Applicationswith USB FS, Serial Interface, 32-bit counter/timers, FlexPWM, 12-bit 4.0Msamples/sec ADC, Comparator, Temperature Sensor

•Single Arm Cortex-M33 Core. No FPU, no DSP extension instructionset, no TrustZone, no MPU

•Industrial Strength: Industrial communication protocol support, BLDC/PMSM Motor Control support, integrated sensor interfaces (MIPI-I3C,I2C, SPI)

•Power-efficient: 59 μA/MHz active current, 6.5 μA power-down modewith all SRAM retention, 394 nA Deep Power-down mode

Target Applications

•Industrial and Consumer IoT

•Industrial Communications

•Smart Metering

•Motor Control

•Automation & Control

•Sensors

CPU Core Platform

•CPU: Cortex-M33

•Multilayer Bus Matrix

•One 4-CH DMA, supports asynchronous DMA

Memories and memory expansion

•Single-bank Flash: Up to 128 KB FLASH with ECC (supportone bit correction and two bits detection)

•Cache Engine with 4 KB RAM

•Up to 32 KB RAM, configurable as up to 8 KB RAM with ECC(support single bit correction, two bits detection)

•All RAM can be retained down to deep power down mode

•16 KB ROM

Security

•Life cycle management

•Flash read/write/execute permission protect byMBC and lockable

•128-bit Universal Unique Identifier (UUID) perdevice in accordance with IETF's RFC4122 version5 specification

•Code Watchdog for code flow integrity checking

•Read Out Protection (RoP) from flash with 3 levelsof factory access control to customize returnshandling

•Glitch attack resistant keyed access (Glikey) tosecurity sensitive registers

Analog modules

•1x 12-bit ADC

—4 Msps in 12-bit mode

—Up to 24 ADC Input channels (depending on the package)

—Reduced bandwidth 16b mode

—Integrated temperature sensor

•Two High-speed Comparators with 8 input pins anda 8-bit DAC as internal reference

Low-Power Performance

•Active

—59 μA/MHz in Active Mode (CoreMark executing from flash, 3.3 V @25 °C )

•Deep Sleep

—20.28 μA, 7.4 μs wake-up ( 3.3 V @25 °C)

•Power Down

—6.5 μA, 17.1 μs wake-up (full SRAM retention, 3.3 V@ 25 °C

•Deep Power Down

—394 nA, 2.36 ms wake-up (wakeup timer disabled, reset pin enabled, all SRAM off, 3.3 V @25 °C)

Flexible System and Clocks

•192 MHz MHz free-running oscillator (FRO-192M)

•12 MHz free-running oscillator (FRO-12M)

•16 kHz free-running oscillator (FRO-16k)

•Up to 50 MHz crystal oscillator

Inputs Supply Voltage options:

•Integrated voltage regulator or support for external voltage regulator

—LVD for VDD_CORE and VDD

—HVD for VDD

—Core LDO, other LDOs

—Operating voltage: 1.71 V to 3.6 V

—IOs: 1.71 V - 3.6 V full-performance

Operating Characteristics

•Temperature range (junction): -40 °C to 125 °C

—1x CMP is functional down to DPD mode

Communication interfaces

•USB Full-speed (Device) with on-chip FS PHY

•2x LPSPI, 1x LPI2C, 3x LPUART, 1x I3C

Motor Control Subsys

•1x FlexPWM each with 3 submodules, providing 9 PWM outputs (no Nanoedge module)

•1x Quadrature Encoder/Decoder (QDC)

•1x AOI

Timers

•Three 32-bit standard general-purpose asynchronous timers/counters, which support up to four capture inputs and four compare outputs, PWM mode, and external count input. Specific timer events can be selected to generate DMA requests

•LPTimer

•Frequency measurement timer

•Windowed Watchdog Timer

•Wake Timer

•Micro Timer

•OS Event Timer

HMI

•Up to 52 GPIOs

—Up to eight 20 mA IO

—50 MHz IO on P1 and P3

—Up to 19-pin wake-up sources function down to deep power-down mode

—Support 1.71 V~3.6 V IO supply range