Wire Wound Chip Inductors

Features • Wire wound ceramic construction provide high SRF. • Ultra-compact inductors provide exceptional Q values. • Low profile, high current are available. • Miniature SMD chip inductor for fully automated assembly. • Outstanding endurance from pull-up force, mechanical shock and pressure

文件：436.3 Kbytes 页数：8 Pages

MULTICOMP

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Wire Wound Chip Inductor

文件：622.48 Kbytes 页数：10 Pages

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文件：278.84 Kbytes 页数：2 Pages

OPLINK

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文件：147.12 Kbytes 页数：2 Pages

MULTICOMP

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