首页>MC0805S8F226KT4E>规格书详情
MC0805S8F226KT4E中文资料易络盟数据手册PDF规格书
相关芯片规格书
更多MC0805S8F226KT4E规格书详情
特性 Features
• Small size and lightweight
• Suitable for both flow and reflow soldering
• Reduction of assembly costs and matching with placement machines
首页>MC0805S8F226KT4E>规格书详情
特性 Features
• Small size and lightweight
• Suitable for both flow and reflow soldering
• Reduction of assembly costs and matching with placement machines
