MBR5H100MFS_V01中文资料安森美半导体数据手册PDF规格书

These state−of−the−art devices have the following features:

特性 Features

• Low Power Loss / High Efficiency

• New Package Provides Capability of Inspection and Probe After

Board Mounting

• Guardring for Stress Protection

• Low Forward Voltage Drop

• 175°C Operating Junction Temperature

• NRVB Prefix for Automotive and Other Applications Requiring

Unique Site and Control Change Requirements; AEC−Q101

Qualified and PPAP Capable

• These are Pb−Free Devices

Mechanical Characteristics:

• Case: Epoxy, Molded

• Epoxy Meets Flammability Rating UL 94−0 @ 0.125 in.

• Lead Finish: 100% Matte Sn (Tin)

• Lead and Mounting Surface Temperature for Soldering Purposes:

260°C Max. for 10 Seconds

• Device Meets MSL 1 Requirements