MBR230LSFT1G分立半导体产品的二极管-整流器-单规格书PDF中文资料

MBR230LSFT1G属于分立半导体产品的二极管-整流器-单。由安森美半导体公司制造生产的MBR230LSFT1G二极管 - 整流器 - 单单整流器二极管系列产品可用于让电流仅沿一个方向流动，并且每个器件封装都恰好实现该功能的一个实例。其他用途的二极管（包括齐纳二极管和可变电容二极管）单独列在各自的产品系列中，每个器件封装中包含多个二极管的产品也是如此。

This device uses the Schottky Barrier principle with a large area

metal−to−silicon power diode. Ideally suited for low voltage, high

frequency rectification or as free wheeling and polarity protection

diodes in surface mount applications where compact size and weight

are critical to the system. This package also provides an easy to work

with alternative to leadless 34 package style. Because of its small size,

it is ideal for use in portable and battery powered products such as

cellular and cordless phones, chargers, notebook computers, printers,

PDAs and PCMCIA cards. Typical applications are AC−DC and

DC−DC converters, reverse battery protection, and “Oring” of

multiple supply voltages and any other application where performance

and size are critical.

Features

 Guardring for Stress Protection

 Low Forward Voltage

 125C Operating Junction Temperature

 Epoxy Meets UL 94 V−0

 Package Designed for Optimal Automated Board Assembly

 ESD Ratings: Machine Model, C

Human Body Model, 3B

 NRVB Prefix for Automotive and Other Applications Requiring

Unique Site and Control Change Requirements; AEC−Q101

Qualified and PPAP Capable

 These Devices are Pb−Free and are RoHS Compliant

Mechanical Characteristics

 Reel Options: MBR230LSFT1G = 3,000 per 7 in reel/8 mm tape

 Device Marking: L3N

 Polarity Designator: Cathode Band

 Weight: 11.7 mg (approximately)

 Case: Epoxy, Molded

 Lead Finish: 100% Matte Sn (Tin)

 Lead and Mounting Surface Temperature for Soldering Purposes:

260C Max. for 10 Seconds

 Device Meets MSL 1 Requirements