MAT10210中文资料Thin Film Attenuator Pads数据手册MACOM规格书

描述 Description

MACOM attenuator chips are fabricated using our state of the art thin film metallization and advanced photolithography technology. All devices are available in chip form with a metalized ground connection on the back. This ground is wrapped around on the four corners of the chip so additional ground bonding ribbon is not required. The chips may be attached using conductive epoxy or solder preform. Gold contacts on the input and output pads make assembly, using standard bonding equipment, fast and reliable. Custom values and configuration available on request.

特性 Features

·RoHS
·Space Saving Footprint .030” X .030” (762 X .762mm)
·Return Loss > 16 dB 13 to 40 GHz
·Return Loss > 18 dB DC to 12 GHz
·Flat Response From DC to 40 GHz
·Medium Power Handling 2W CW
·DC to 40 GHz
·Ground Wrap to Top (No ground bonding required)
·Very Good Stability Over Temperature (TCR < 100 PPM)