MADP-000235-10720T中文资料High Avg. Power SMQ数据手册MACOM规格书

描述 Description

The MADP-000235-10720T is a surface mount PIN diode in a non-magnetic Metal Electrode Leadless Faced (MELF) package. The MADP-000235-10720T is manufactured using MACOM's time proven HIPAX technology. The result is a low inductance ceramic package with no ribbons or wires. The package utilizes a unique non-magnetic plating process that provides for a hermetically sealed component that has extremely low electromagnetic permeability. Incorporated in the package is a glass passivated CERMA chip that is full face bonded on the cathode and anode which maximizes the surface contact area to minimize the electrical and thermal resistances. The chip and package have been comprehensively characterized both electrically and mechanically to ensure repeatable and predictable performance. The MADP-000235-10720T is designed for circuit protection and the tuning of RF coil designs in MRI applications. When connected in an anti-parallel configuration these PIN diodes provide excellent protection from long RF pulses and spikes.

特性 Features

·Non-Magnetic Package for MRI Applications
·RoHS Compliant
·Hermetically Sealed
·Rectangular MELF Ceramic Package

应用 Application

·Aerospace and Defense
·ISM