MA4SPS302中文资料Surmount PIN Diode数据手册MACOM规格书

描述 Description

This device is a Silicon-Glass PIN diode chip fabricated with MACOM’s patented HMIC™ process. This device features two silicon pedestals embedded in a low loss, low dispersion glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls electrically conductive. Selective backside metallization is applied producing a surface mount device. This vertical conic topology provides for exceptional heat transfer from the active area. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch and impact protection. These protective coatings prevent damage to the junction and the anode air-bridge during handling and assembly.

特性 Features

·Surface Mount
·RoHS Compliant
·Low Parasitic Capacitance and Inductance
·Polymer Scratch Protection
·Silicon Nitride Passivation
·Rugged Silicon-Glass Construction
·No Wire Bonding Required
·High Average and Peak Power Handling

应用 Application

·Aerospace and Defense
·ISM