MA4P7470-1072T中文资料MA-COM数据手册PDF规格书

Description and Applications

The MA4P7470F-1072T is a surface mountable PIN diode in a non-magnetic Metal Electrode Leadless Faced (MELF) package. The device incorporates M/A-COM Technology Solutions time proven HIPAX technology to produce a low inductance ceramic package with no ribbons or whisker wires. The package utilizes M/A-COM Technology Solutions new non-magnetic plating process to provide a hermetically sealed package with extremely low permeability. Incorporated within the package is a glass passivated PIN chip that is full face bonded on both the cathode and anode to maximize surface area for low electrical and thermal resistance. The low thermal resistance provides excellent performance at high incident power levels of up to 200 watts CW. The MA4P7470F-1072T has been comprehensively characterized both electrically and mechanically to ensure repeatable and predictable performance.

Features

• Non-Magnetic Package Suitable for MRI

Applications

• Rectangular MELF SMQ Ceramic Package

• Hermetically Sealed

• Low Rs for Low Insertion Loss

• Long τL for Low Intermodulation Distortion

• Low Cj for High Series Isolation

• High Average Incident Power Handling

Capability

• RoHS Compliant