8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product

DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT

文件：247.26 Kbytes 页数：35 Pages

STMICROELECTRONICS

意法半导体

8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product

DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT

文件：247.26 Kbytes 页数：35 Pages

STMICROELECTRONICS

意法半导体

8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product

DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT

文件：247.26 Kbytes 页数：35 Pages

STMICROELECTRONICS

意法半导体

8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product

DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT

文件：247.26 Kbytes 页数：35 Pages

STMICROELECTRONICS

意法半导体

8 Mbit 1Mb x8, Boot Block Flash Memory and 1 Mbit 128Kb x8 SRAM Low Voltage Multi-Memory Product

DESCRIPTION The M36W108 is multi-chip device containing an 8 Mbit boot block Flash memory and a 1 Mbit of SRAM. The device is offered in the new Chip Scale Package solutions: LBGA48 1.0 mm ball pitch and LGA48 1.0 mm land pitch. ■ M36W108T and M36W108B are replaced respectively by the M36W108AT

文件：247.26 Kbytes 页数：35 Pages

STMICROELECTRONICS

意法半导体