Memory Micromodules General Information for D1, D2 and C Packaging

DESCRIPTION Memory Cards consist of two main parts: the plastic card, and the embedded Micromodule (which, in turn, carries the silicon chip). ■ Micromodules were developed specifically for embedding in Smartcards and Memory Cards ■ The Micromodule provides: – Support for the chi

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STMICROELECTRONICS

意法半导体

Memory Card IC 64/32 Kbit Serial I짼C Bus EEPROM

DESCRIPTION Each device is an electrically erasable programmable memory (EEPROM) fabricated with STMicroelectronics’s High Endurance, Single Polysilicon, CMOS technology. This guarantees an endurance typically well above one million Erase/Write cycles, with a data retention of 40 years. The memor

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STMICROELECTRONICS

意法半导体

ALI
BGA

ALI

扬智科技

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ALI
BGA

ALI

扬智科技

上传：深圳市东来宝电子科技有限公司

SHINDENGEN
SOD123

SHINDENGEN

上传：佛山市芯光达科技有限公司