M14C04DD中文资料意法半导体数据手册PDF规格书

PRODUCT M14C04

■ WAFER SIZE 152 mm (6 inches)

■ DIE IDENTIFICATION M14C04KA_R

■ DIE SIZE (X x Y) 1465 x 1585 µm

■ SCRIBE LINE 101.6 x 101.6 µm

■ PAD OPENING 100 x 100 µm

DIE LAYOUT

■ DI Die Identification (at the position shown in Figure 1)

■ C1, C2, C3, C5, C7 Pad contacts to the ISO pins (at the positions shown in Figure 1)

■ C4, C6, C8 These ISO pins do not appear on the M14C04 die

■ NC This pad, shown in Figure 1, is Not Connected

Pad locations are measured relative to the die centre (where X and Y are respectively the horizontal and vertical axis, measured in µm).