M13S64164A中文资料晶豪科技数据手册PDF规格书

特性 Features

• JEDEC Standard

• Internal pipelined double-data-rate architecture, two data access per clock cycle

• Bi-directional data strobe (DQS)

• On-chip DLL

• Differential clock inputs (CLK and CLK )

• DLL aligns DQ and DQS transition with CLK transition

• Quad bank operation

• CAS Latency : 2, 2.5, 3

• Burst Type : Sequential and Interleave

• Burst Length : 2, 4, 8

• All inputs except data & DM are sampled at the rising edge of the system clock(CLK)

• Data I/O transitions on both edges of data strobe (DQS)

• DQS is edge-aligned with data for reads; center-aligned with data for WRITE

• Data mask (DM) for write masking only

• For 2.5V parts, VDD = 2.3V ~ 2.7V, VDDQ = 2.3V ~ 2.7V

• Auto & Self refresh

• 64ms refresh period, 4K cycle

• SSTL-2 I/O interface

• 66pin TSOPII and 60 ball BGA package