BMP®51 and BMP®53 Materials

文件：431.56 Kbytes 页数：1 Pages

BRADY

BMP®51 and BMP®53 Materials

文件：431.56 Kbytes 页数：1 Pages

BRADY

High Reliability Thick Film Resistor,Surface Mount Chip

文件：104.15 Kbytes 页数：4 Pages

VISHAYVishay Siliconix

威世威世科技公司

Label format - Old format order code cross reference

文件：3.00256 Mbytes 页数：48 Pages

MACOM

Label format - Old format order code cross reference

文件：3.00256 Mbytes 页数：48 Pages

MACOM

Disc Neodymium Magnet

HSI Sensing

High Reliability Thick Film Resistor, Surface-Mount Chip

High purity alumina substrate for high power dissipation (2 W max.)\nWraparound terminations featuring a thin film adhesion layer covered with a leach resistant nickel barrier layer for +150 °C operating conditions\nHigh speed laser trimming for high volume requirements;

Vishay

威世

High Reliability Thick Film Resistor, Surface-Mount Chip

High purity alumina substrate for high power dissipation (2 W max.)\nWraparound terminations featuring a thin film adhesion layer covered with a leach resistant nickel barrier layer for +150 °C operating conditions\nHigh speed laser trimming for high volume requirements;

Vishay

威世

包装：散装 类别：电缆，电线 - 管理 标签，标记 描述：SLEEVE, 0.25\

Brady Corporation

包装：盒 类别：RF/IF，射频/中频和 RFID RF 定向耦合器 描述：HYBRID COUPLER

L3 Narda-MITEQ