High Reliability Thick Film Resistor,Surface Mount Chip

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VISHAYVishay Siliconix

威世威世科技公司

BMP®51 and BMP®53 Materials

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BRADY

BMP®51 and BMP®53 Materials

文件：431.56 Kbytes 页数：1 Pages

BRADY

Label format - Old format order code cross reference

文件：3.00256 Mbytes 页数：48 Pages

MACOM

包装：散装 类别：连接器，互连器件 隔板块 描述：CONN BARRIER STRIP 12CIRC 0.5\

CURTISINDUSTRIES

High Reliability Thick Film Resistor, Surface-Mount Chip

High purity alumina substrate for high power dissipation (2 W max.)\nWraparound terminations featuring a thin film adhesion layer covered with a leach resistant nickel barrier layer for +150 °C operating conditions\nHigh speed laser trimming for high volume requirements;

Vishay

威世

High Reliability Thick Film Resistor, Surface-Mount Chip

High purity alumina substrate for high power dissipation (2 W max.)\nWraparound terminations featuring a thin film adhesion layer covered with a leach resistant nickel barrier layer for +150 °C operating conditions\nHigh speed laser trimming for high volume requirements;

Vishay

威世

包装：盒 类别：工具 电铲，钩，镊子，探针，调节工具 描述：HOOK CURVED STEEL 6\

Jonard Tools

包装：散装 类别：标签，标志，护栏，标识 标签，贴纸，贴标 - 空白 描述：LABEL 1\

Brady Corporation