首页 >LTB119>规格书列表
| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
PhotodarlingtonOptocoupler(NoBaseConnection) Description TheMOC119Mdevicehasagalliumarsenideinfraredemittingdiodecoupledtoasilicondarlingtonphototransistor. Features ■Highcurrenttransferratioof300 ■Nobaseconnectionforimprovednoiseimmunity ■UnderwritersLaboratory(UL)recognizedFile#E90700 ■ | FairchildFairchild Semiconductor 仙童半导体飞兆/仙童半导体公司 | Fairchild | ||
PhotodarlingtonOptocoupler(NoBaseConnection) Description TheMOC119Mdevicehasagalliumarsenideinfraredemittingdiodecoupledtoasilicondarlingtonphototransistor. Features ■Highcurrenttransferratioof300 ■Nobaseconnectionforimprovednoiseimmunity ■UnderwritersLaboratory(UL)recognizedFile#E90700 ■ | FairchildFairchild Semiconductor 仙童半导体飞兆/仙童半导体公司 | Fairchild | ||
PhotodarlingtonOptocoupler(NoBaseConnection) Description TheMOC119Mdevicehasagalliumarsenideinfraredemittingdiodecoupledtoasilicondarlingtonphototransistor. Features ■Highcurrenttransferratioof300 ■Nobaseconnectionforimprovednoiseimmunity ■UnderwritersLaboratory(UL)recognizedFile#E90700 ■ | FairchildFairchild Semiconductor 仙童半导体飞兆/仙童半导体公司 | Fairchild | ||
PhotodarlingtonOptocoupler(NoBaseConnection) Description TheMOC119Mdevicehasagalliumarsenideinfraredemittingdiodecoupledtoasilicondarlingtonphototransistor. Features ■Highcurrenttransferratioof300 ■Nobaseconnectionforimprovednoiseimmunity ■UnderwritersLaboratory(UL)recognizedFile#E90700 ■ | FairchildFairchild Semiconductor 仙童半导体飞兆/仙童半导体公司 | Fairchild | ||
ReinforcedInsulationratedfor300VACWorkingVoltage | TOTAL-POWER Total Power International | TOTAL-POWER | ||
DC/DCCONVERTER2W,ReinforcedInsulation,MedicalSafety | MINMAXMinmax Technology Co., Ltd. 捷拓科技台湾捷拓科技股份有限公司 | MINMAX | ||
1W,MiniatureSMD,Single&DualOutputDC/DCConverters | MINMAXMinmax Technology Co., Ltd. 捷拓科技台湾捷拓科技股份有限公司 | MINMAX | ||
DC/DCCONVERTER1W,SMDPackagewithIndustryStandardPinout | MICMIC GROUP RECTIFIERS 昌福电子昌福电子有限公司 | MIC | ||
SMDPackagewithIndustryStandardPinout | TOTAL-POWER Total Power International | TOTAL-POWER | ||
3WATTGLASSZENERDIODES FEATURES ●Microminiaturepackage. ●Voidlesshermeticallysealedglasspackage. ●Triplelayerpassivation. ●Metallurgicallybonded. ●Highperformancecharacteristics. ●Stableoperationattemperatureto200°C ●Verylowthermalimpedance. | MicrosemiMicrosemi Corporation 美高森美美高森美公司 | Microsemi |
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