Package：16-WQFN 裸露焊盘；包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 类别：RF/IF，射频/中频和 RFID 射频混频器 描述：IC MIXER 1KHZ-3GHZ DWN 16QFN

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亚德诺

Package：16-WQFN 裸露焊盘；包装：托盘 类别：RF/IF，射频/中频和 RFID 射频混频器 描述：IC MIXER 1KHZ-3GHZ DWN 16QFN

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亚德诺

InGaP HBT 2.4 - 2.5 GHz Power Amplifier

DESCRIPTION The LX5512B is a power amplifier optimized for WLAN applications in the 2.4-2.5 GHz frequency range. The PA is implemented as a threestage monolithic microwave integrated circuit (MMIC) with active bias and input/output pre-matching. The device is manufactured with an InGaP/GaAs Heter

文件：178.02 Kbytes 页数：6 Pages

Microsemi

美高森美

InGaP HBT 2.4 ??2.5 GHz Power Amplifier

文件：553.61 Kbytes 页数：8 Pages

Microsemi

美高森美

InGaP HBT 2.4 - 2.5 GHz Power Amplifier

DESCRIPTION The LX5512B is a power amplifier optimized for WLAN applications in the 2.4-2.5 GHz frequency range. The PA is implemented as a threestage monolithic microwave integrated circuit (MMIC) with active bias and input/output pre-matching. The device is manufactured with an InGaP/GaAs Heter

文件：178.02 Kbytes 页数：6 Pages

Microsemi

美高森美