LSM6DSOX传感器变送器的运动传感器-IMU（惯性测量装置、单元）规格书PDF中文资料

LSM6DSOX属于传感器变送器的运动传感器-IMU（惯性测量装置、单元）。由意法半导体集团制造生产的LSM6DSOX运动传感器 - IMU（惯性测量装置、单元）运动传感器 - IMU（惯性测量装置）是一种利用加速计、陀螺仪和磁力仪测量速度、方向和磁力以获取方向、正确加速度和位置的器件。其他类型的传感器包括温度传感器、倾角仪和气压计。

特性 Features

• Power consumption: 0.55 mA in combo high-performance mode

• “Always-on experience with low power consumption for both accelerometer and

gyroscope

• Smart FIFO up to 9 kbyte

• Android compliant

• ±2/±4/±8/±16 g full scale

• ±125/±250/±500/±1000/±2000 dps full scale

• Analog supply voltage: 1.71 V to 3.6 V

• Independent IO supply (1.62 V)

• Compact footprint: 2.5 mm x 3 mm x 0.83 mm

• SPI / I²C & MIPI I3CSM serial interface with main processor data synchronization

• Auxiliary SPI for OIS data output for gyroscope and accelerometer

• OIS configurable from Aux SPI, primary interface (SPI / I²C & MIPI I3CSM)

• Advanced pedometer, step detector and step counter

• Significant Motion Detection, Tilt detection

• Standard interrupts: free-fall, wakeup, 6D/4D orientation, click and double-click

• Programmable finite state machine: accelerometer, gyroscope and external

sensors

• Machine Learning Core

• S4S data synchronization

• Embedded temperature sensor

• ECOPACK®, RoHS and “Green” compliant

描述 Description

The LSM6DSOX is a system-in-package featuring a 3D digital accelerometer and a

3D digital gyroscope boosting performance at 0.55 mA in high-performance mode

and enabling always-on low-power features for an optimal motion experience for the

consumer.

The LSM6DSOX supports main OS requirements, offering real, virtual and batch

sensors with 9 kbytes for dynamic data batching. ST’s family of MEMS sensor

modules leverages the robust and mature manufacturing processes already used for

the production of micromachined accelerometers and gyroscopes. The various

sensing elements are manufactured using specialized micromachining processes

Applications

• Motion tracking and gesture detection

• Sensor hub

• Indoor navigation

• IoT and connected devices

• Smart power saving for handheld devices

• EIS and OIS for camera applications

• Vibration monitoring and compensation