Power-down and sleep modes

文件：1.91251 Mbytes 页数：75 Pages

STMICROELECTRONICS

意法半导体

iNEMO inertial module: 3D accelerometer and 3D gyroscope

The LSM330 is a system-in-package featuring a 3D digital accelerometer with two embedded state machines that can be programmed to implement autonomous applications and a 3D digital gyroscope.\nST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for Analog supply voltage: 2.4 V to 3.6 V\nDigital supply voltage IOs: 1.8 V\nPower-down and sleep modes\n2 embedded programmable state machines\n3 independent acceleration channels and 3 angular rate channels\n±2/±4/±6/±8/±16 g selectable full scale\n±250/±500/±2000 dps selectable full scale\nSPI/I2C s;

ST

意法半导体

Linear sensor module 3D accelerometer sensor and 3D gyroscope sensor

Description The LSM330DL is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope. ST’s family of modules leverages a robust and mature manufacturing process already used for the production of micromachined accelerometers. The various sensing elements are manufactu

文件：1.07009 Mbytes 页数：54 Pages

STMICROELECTRONICS

意法半导体

iNEMO inertial module: 3D accelerometer and 3D gyroscope

Description The LSM330DLC is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope. ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers. The various sensing eleme

文件：1.46976 Mbytes 页数：66 Pages

STMICROELECTRONICS

意法半导体

iNEMO inertial module: 3D accelerometer and 3D gyroscope

Description The LSM330DLC is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope. ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers. The various sensing eleme

文件：1.46976 Mbytes 页数：66 Pages

STMICROELECTRONICS

意法半导体

Linear sensor module 3D accelerometer sensor and 3D gyroscope sensor

Description The LSM330DL is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope. ST’s family of modules leverages a robust and mature manufacturing process already used for the production of micromachined accelerometers. The various sensing elements are manufactu

文件：1.07009 Mbytes 页数：54 Pages

STMICROELECTRONICS

意法半导体

Low power mode

文件：1.50827 Mbytes 页数：66 Pages

STMICROELECTRONICS

意法半导体

iNEMO inertial module: 3D accelerometer and 3D gyroscope

The LSM330DLC is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope.\nST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers.\nThe various sensing elements are manufac Analog supply voltage: 2.4 V to 3.6 V\nDigital supply voltage IOs: 1.8 V\nLow power mode\nPower-down mode\n3 independent acceleration channels and 3 angular rate channels\n±2 g/±4 g/±8 g/±16 g dynamically selectable full scale\n±250/±500/±2000 dps dynamically selectable full scale\nSPI/I2C serial in;

ST

意法半导体

Low power mode

ST

意法半导体

Package：28-TFLGA 模块；包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 类别：传感器，变送器 运动传感器 - IMU（惯性测量装置、单元） 描述：IMU ACCEL/MAG I2C/SPI 28LGA

STMICROELECTRONICS

意法半导体