LMZ31710电源-板安装的直流转换器规格书PDF中文资料

LMZ31710属于电源-板安装的直流转换器。由德州仪器制造生产的LMZ31710直流转换器一种旨在将直流电压输入电平改变为一个或多个不同的直流电压输出电平的装置。

1 Features

1• Complete integrated power solution

– Small footprint, low-profile design

– Pin compatible with LMZ31707 and LMZ31704

– 10-mm × 10-mm × 4.3-mm package

• Efficiencies up to 95%

• Eco-Mode™ and light load efficiency (LLE)

• Wide-output voltage adjust

0.6 V to 5.5 V, With 1% reference accuracy

• Supports parallel operation for higher current

• Optional split power rail allows

input voltage down to 2.95 V

• Adjustable switching frequency

(200 kHz to 1.2 MHz)

• Synchronizes to an external clock

• Provides 180° out-of-phase clock signal

• Adjustable slow start

• Output voltage sequencing and tracking

• Power-good output

• Programmable undervoltage lockout (UVLO)

• Overcurrent and overtemperature protection

• Prebias output start-up

• Operating temperature range: –40°C to +85°C

• Enhanced thermal performance: 13.3°C/W

• Meets EN55022 Class B emissions

- integrated shielded inductor

• Create a custom design using the LMZ31710 with

the WEBENCH® Power Designer

2 Applications

• Broadband and communications infrastructure

• Automated test and medical equipment

• Compact PCI / PCI Express / PXI express

• DSP and FPGA point-of-load applications

3 Description

The LMZ31710 power module is an easy-to-use

integrated power solution that combines a 10-A

DC/DC converter with power MOSFETs, a shielded

inductor, and passives into a low-profile QFN

package. This total power solution allows as few as

three external components and eliminates the loop

compensation and magnetics part selection process.

The 10 × 10 × 4.3 mm QFN package is easy to

solder onto a printed circuit board and allows a

compact point-of-load design. The device achieves

greater than 95% efficiency and excellent power

dissipation capability with a thermal impedance of

13.3°C/W. The LMZ31710 offers the flexibility and the

feature set of a discrete point-of-load design and is

ideal for powering a wide range of ICs and systems.

Advanced packaging technology affords a robust and

reliable power solution compatible with standard QFN

mounting and testing techniques.