LMZ31530RLGTG4.B中文资料德州仪器数据手册PDF规格书

1 Features

1• Complete Integrated Power Solution;

Smaller than a Discrete Design

• 15 mm × 16 mm × 5.8 mm Package Size

- Pin Compatible with LMZ31520

• Ultra-Fast Load Step Response

• Efficiencies Up To 96%

• Wide-Output Voltage Adjust

0.6 V to 3.6 V, with 1% Reference Accuracy

• Optional Split Power Rails Allows

Input Voltage Down to 3 V

• Selectable Switching Frequency;

(300 kHz to 850 kHz)

• Selectable Slow-Start

• Adjustable Over Current Limit

• Power Good Output

• Output Voltage Sequencing

• Over Temperature Protection

• Pre-bias Output Start-up

• Operating Temperature Range: –40°C to 85°C

• Enhanced Thermal Performance: 8.6°C/W

• Meets EN55022 Class A Emissions

- Integrated Shielded Inductor

• Create a Custom Design Using the LMZ31530

With the WEBENCH® Power Designer

2 Applications

• Broadband and Communications Infrastructure

• DSP and FPGA Point of Load Applications

• High Density Power Systems

3 Description

The LMZ31530 power module is an easy-to-use

integrated power solution that combines a 30-A

DC/DC converter with power MOSFETs, a shielded

inductor, and passives into a low profile, QFN

package. This total power solution allows as few as

three external components and eliminates the loop

compensation and magnetics part selection process.

The 15 × 16 × 5.8 mm, QFN package is easy to

solder onto a printed circuit board and allows a

compact point-of-load design. Achieves greater than

95% efficiency, has ultra-fast load step response and

excellent power dissipation capability with a thermal

impedance of 8.6°C/W. The LMZ31530 offers the

flexibility and the feature-set of a discrete point-ofload

design and is ideal for powering a wide range of

ICs and systems. Advanced packaging technology

affords a robust and reliable power solution

compatible with standard QFN mounting and testing

techniques.