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LMZ31503RUQR.A中文资料德州仪器数据手册PDF规格书

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厂商型号

LMZ31503RUQR.A

功能描述

LMZ31503 3-A Power Module With 4.5-V to 14.5-V Input in QFN Package

丝印标识

LMZ31503

封装外壳

B1QFN(RUQ)

文件大小

1.29023 Mbytes

页面数量

38

生产厂商

TI

中文名称

德州仪器

网址

网址

数据手册

下载地址一下载地址二到原厂下载

更新时间

2025-11-1 11:46:00

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LMZ31503RUQR.A规格书详情

1 Features

1• Complete Integrated Power Solution Allows

Small Footprint, Low-Profile Design

• 9 mm × 15mm × 2.8mm package

- Pin Compatible with LMZ31506

• Efficiencies Up To 95%

• Wide-Output Voltage Adjust

0.8 V to 5.5 V, with 1% Reference Accuracy

• Optional Split Power Rail Allows

Input Voltage Down to 1.6 V

• Adjustable Switching Frequency

(330 kHz to 780 kHz)

• Synchronizes to an External Clock

• Adjustable Slow-Start

• Output Voltage Sequencing / Tracking

• Power Good Output

• Programmable Undervoltage Lockout (UVLO)

• Overcurrent Protection (Hiccup-Mode)

• Over Temperature Protection

• Pre-bias Output Start-up

• Operating Temperature Range: –40°C to +85°C

• Enhanced Thermal Performance: 13°C/W

• Meets EN55022 Class B Emissions

- Integrated Shielded Inductor

• Create a Custom Design Using the LMZ31503

With the WEBENCH® Power Designer

2 Applications

• Broadband & Communications Infrastructure

• Automated Test and Medical Equipment

• Compact PCI / PCI Express / PXI Express

• DSP and FPGA Point of Load Applications

• High Density Distributed Power Systems

3 Description

The LMZ31503 power module is an easy-to-use

integrated power solution that combines a 3-A DC/DC

converter with power MOSFETs, a shielded inductor,

and passives into a low profile, QFN package. This

total power solution allows as few as 3 external

components and eliminates the loop compensation

and magnetics design process.

The 9×15×2.8 mm QFN package is easy to solder

onto a printed circuit board and allows a compact

point-of-load design with up to 95% efficiency and

excellent power dissipation with a thermal impedance

of 13°C/W junction to ambient. The device delivers

the full 3-A rated output current at 85°C ambient

temperature without airflow.

The LMZ31503 offers the flexibility and the featureset

of a discrete point-of-load design and is ideal for

powering performance DSPs and FPGAs. Advanced

packaging technology afford a robust and reliable

power solution compatible with standard QFN

mounting and testing techniques.

供应商 型号 品牌 批号 封装 库存 备注 价格
TI/德州仪器
25+
原厂原封可拆样
64687
百分百原装现货 实单必成 欢迎询价
询价
TI/德州仪器
21+
B1QFN-47
10000
只做原装,质量保证
询价
TI/原装含税
24+
QFN47
1500
市场最低 原装现货 假一罚百 可开原型号
询价
TI/德州仪器
24+
B1QFN-47
6000
全新原装深圳仓库现货有单必成
询价
TI/德州仪器
25+
原厂封装
10280
询价
TI(德州仪器)
25+
N/A
6000
原装,请咨询
询价
TI
三年内
1983
只做原装正品
询价
TI/德州仪器
22+
QFN47
2500
原装正品
询价
TI(德州仪器)
2447
B1QFN-47
105000
250个/圆盘一级代理专营品牌!原装正品,优势现货,长
询价
TI/德州仪器
23+
B1QFN47
50000
全新原装正品现货,支持订货
询价