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LMZ30606RKGR.B中文资料德州仪器数据手册PDF规格书

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厂商型号

LMZ30606RKGR.B

功能描述

LMZ30606 6A Power Module with 2.95V-6V Input in QFN Package

丝印标识

54618

封装外壳

B1QFN

文件大小

894.33 Kbytes

页面数量

34

生产厂商

TI

中文名称

德州仪器

网址

网址

数据手册

下载地址一下载地址二到原厂下载

更新时间

2025-10-8 23:00:00

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LMZ30606RKGR.B规格书详情

1 Features

1• Complete Integrated Power Solution Allows

Small Footprint, Low-Profile Design

• 9mm x 11mm x 2.8mm package

- Pin Compatible with LMZ30602 & LMZ30604

• Efficiencies Up To 96%

• Wide-Output Voltage Adjust

0.8 V to 3.6 V, with ±1% Reference Accuracy

• Adjustable Switching Frequency

(500 kHz to 2 MHz)

• Synchronizes to an External Clock

• Adjustable Slow-Start

• Output Voltage Sequencing / Tracking

• Power Good Output

• Programmable Undervoltage Lockout (UVLO)

• Output Overcurrent Protection

• Over Temperature Protection

• Operating Temperature Range: –40°C to 85°C

• Enhanced Thermal Performance: 12°C/W

• Meets EN55022 Class B Emissions

- Integrated Shielded Inductor

• Create a Custom Design Using the LMZ30606

With the WEBENCH® Power Designer

2 Applications

• Broadband and Communications Infrastructure

• Automated Test and Medical Equipment

• Compact PCI / PCI Express / PXI Express

• DSP and FPGA Point of Load Applications

• High Density Distributed Power Systems

3 Description

The LMZ30606 SIMPLE SWITCHER® power module

is an easy-to-use integrated power solution that

combines a 6-A DC/DC converter with power

MOSFETs, a shielded inductor, and passives into a

low profile, QFN package. This total power solution

requires as few as 3 external components and

eliminates the loop compensation and magnetics part

selection process.

The 9×11×2.8 mm QFN package is easy to solder

onto a printed circuit board and allows a compact

point-of-load design with greater than 90% efficiency

and excellent power dissipation with a thermal

impedance of 12°C/W junction to ambient. The

device delivers the full 6-A rated output current at

85°C ambient temperature without airflow.

The LMZ30606 offers the flexibility and the featureset

of a discrete point-of-load design and is ideal for

powering performance DSPs and FPGAs. Advanced

packaging technology afford a robust and reliable

power solution compatible with standard QFN

mounting and testing techniques.

供应商 型号 品牌 批号 封装 库存 备注 价格
TI(德州仪器)
24+
B1QFN39
7350
现货供应,当天可交货!免费送样,原厂技术支持!!!
询价
TI(德州仪器)
24+
NA/
8735
原厂直销,现货供应,账期支持!
询价
TI
2023+
SMD
5000
安罗世纪电子只做原装正品货
询价
TI(德州仪器)
2024+
B1QFN-39
500000
诚信服务,绝对原装原盘
询价
TI/德州仪器
21+
B1QFN-39
10000
全新原装现货
询价
TI
25+23+
QFN
44741
绝对原装正品全新进口深圳现货
询价
TI/德州仪器
21+
B1QFN-39
10000
只做原装,质量保证
询价
TI/德州仪器
2021+
B1QFN-39
7600
原装现货,欢迎询价
询价
TEXAS INSTRUMENTS
18+
2
公司优势库存 热卖中!
询价
TI 支持实单
24+
B1QFN-39
1400
市场最低 原装现货 假一罚百 可开原型号
询价