Rail-to-Rail Input and Output, 2.7V Op Amp in micro SMD package with Shutdown

文件：755.28 Kbytes 页数：19 Pages

NSCNational Semiconductor (TI)

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丝印：A08；Package：DSBGA；LMC8101 Rail-to-Rail Input and Output, 2.7V Op Amp in DSBGA Package With Shutdown

1FEATURES 2• VS = 2.7V, TA = 25°C, RL to V+/2, Typical Values Unless Specified. • Rail-to-Rail Inputs • Rail-to-Rail Output Swing Within 35mV of Supplies (RL =2kΩ) • Packages Offered: – DSBGA package 1.39mm x 1.41mm – VSSOP package 3.0mm x 4.9mm • Low Supply Current

文件：1.10397 Mbytes 页数：26 Pages

TI

德州仪器

丝印：A08；Package：DSBGA；LMC8101 Rail-to-Rail Input and Output, 2.7V Op Amp in DSBGA Package With Shutdown

1FEATURES 2• VS = 2.7V, TA = 25°C, RL to V+/2, Typical Values Unless Specified. • Rail-to-Rail Inputs • Rail-to-Rail Output Swing Within 35mV of Supplies (RL =2kΩ) • Packages Offered: – DSBGA package 1.39mm x 1.41mm – VSSOP package 3.0mm x 4.9mm • Low Supply Current

文件：1.10397 Mbytes 页数：26 Pages

TI

德州仪器

丝印：A08；Package：DSBGA；LMC8101 Rail-to-Rail Input and Output, 2.7V Op Amp in DSBGA Package With Shutdown

1FEATURES 2• VS = 2.7V, TA = 25°C, RL to V+/2, Typical Values Unless Specified. • Rail-to-Rail Inputs • Rail-to-Rail Output Swing Within 35mV of Supplies (RL =2kΩ) • Packages Offered: – DSBGA package 1.39mm x 1.41mm – VSSOP package 3.0mm x 4.9mm • Low Supply Current

文件：1.10397 Mbytes 页数：26 Pages

TI

德州仪器

丝印：A08；Package：DSBGA；LMC8101 Rail-to-Rail Input and Output, 2.7V Op Amp in DSBGA Package With Shutdown

1FEATURES 2• VS = 2.7V, TA = 25°C, RL to V+/2, Typical Values Unless Specified. • Rail-to-Rail Inputs • Rail-to-Rail Output Swing Within 35mV of Supplies (RL =2kΩ) • Packages Offered: – DSBGA package 1.39mm x 1.41mm – VSSOP package 3.0mm x 4.9mm • Low Supply Current

文件：1.10397 Mbytes 页数：26 Pages

TI

德州仪器

丝印：A08；Package：DSBGA；LMC8101 Rail-to-Rail Input and Output, 2.7V Op Amp in DSBGA Package With Shutdown

1FEATURES 2• VS = 2.7V, TA = 25°C, RL to V+/2, Typical Values Unless Specified. • Rail-to-Rail Inputs • Rail-to-Rail Output Swing Within 35mV of Supplies (RL =2kΩ) • Packages Offered: – DSBGA package 1.39mm x 1.41mm – VSSOP package 3.0mm x 4.9mm • Low Supply Current

文件：1.10397 Mbytes 页数：26 Pages

TI

德州仪器

丝印：A08；Package：DSBGA；LMC8101 Rail-to-Rail Input and Output, 2.7V Op Amp in DSBGA Package With Shutdown

1FEATURES 2• VS = 2.7V, TA = 25°C, RL to V+/2, Typical Values Unless Specified. • Rail-to-Rail Inputs • Rail-to-Rail Output Swing Within 35mV of Supplies (RL =2kΩ) • Packages Offered: – DSBGA package 1.39mm x 1.41mm – VSSOP package 3.0mm x 4.9mm • Low Supply Current

文件：1.10397 Mbytes 页数：26 Pages

TI

德州仪器

Rail-to-Rail Input and Output, 2.7V Op Amp in DSBGA Package With Shutdown

文件：1.55576 Mbytes 页数：26 Pages

TI

德州仪器

Rail-to-Rail Input and Output, 2.7V Op Amp in DSBGA Package With Shutdown

文件：1.55576 Mbytes 页数：26 Pages

TI

德州仪器

Rail-to-Rail Input and Output, 2.7V Op Amp in micro SMD package with Shutdown

文件：755.28 Kbytes 页数：19 Pages

NSCNational Semiconductor (TI)

美国国家半导体美国国家半导体公司