LM158_V06中文资料德州仪器数据手册PDF规格书

1 Features

• Wide supply range of 3 V to 36 V (B, BA versions)

• Quiescent current: 300 μA/ch (B, BA versions)

• Unity-gain bandwidth of 1.2 MHz (B, BA versions)

• Common-mode input voltage range includes

ground, enabling direct sensing near ground

• 2-mV input offset voltage max. at 25°C (BA

version)

• 3-mV input offset voltage max. at 25°C (A, B

versions)

• Internal RF and EMI filter (B, BA versions)

• On products compliant to MIL-PRF-38535, all

parameters are tested unless otherwise noted. On

all other products, production processing does not

necessarily include testing of all parameters.

2 Applications

• Merchant network and server power supply units

• Multi-function printers

• Power supplies and mobile chargers

• Motor control: AC induction, brushed DC,

brushless DC, high-voltage, low-voltage,

permanent magnet, and stepper motor

• Desktop PC and motherboard

• Indoor and outdoor air conditioners

• Washers, dryers, and refrigerators

• AC inverters, string inverters, central inverters, and

voltage frequency drives

• Uninterruptible power supplies

• Electronic point-of-sale systems

3 Description

The LM358B and LM2904B devices are the

next-generation versions of the industry-standard

operational amplifiers (op amps) LM358 and LM2904,

which include two high-voltage (36 V) op amps.

These devices provide outstanding value for costsensitive

applications, with features including low

offset (300 μV, typical), common-mode input range to

ground, and high differential input voltage capability.

The LM358B and LM2904B op amps simplify circuit

design with enhanced features such as unity-gain

stability, lower offset voltage maximum of 3 mV (2 mV

maximum for LM358BA and LM2904BA), and lower

quiescent current of 300 μA per amplifier (typical).

High ESD (2 kV, HBM) and integrated EMI and RF

filters enable the LM358B and LM2904B devices to be

used in the most rugged, environmentally challenging

applications.

The LM358B and LM2904B amplifiers are available

in micro-sized packaging, such as the SOT23-8, as

well as industry standard packages including SOIC,

TSSOP, and VSSOP.