SMT package 0603, colorless diffused resin, 1.6 mm x 0.8 mm x 0.8 mm

文件：418.31 Kbytes 页数：21 Pages

OSRAM

艾迈斯欧司朗

CHIPLED

CHIPLED Features ●0805 package ●Industry standard footprint ●low profile ●suitable for IR reflow soldering process ●for use as optical indicator and backlighting ●available taped on reel (8 mm tape)

文件：52.01 Kbytes 页数：6 Pages

SIEMENS

西门子

Optical Indicator

文件：394.38 Kbytes 页数：20 Pages

OSRAM

艾迈斯欧司朗

Chip LED 0805

Applications - Electronic Equipment - Gaming, Amusement, Gambling Features: - Package: SMT package 0805, colorless diffused resin - Chip technology: GaAsP - Typ. Radiation: 150° - Color: λdom = 570 nm (● green) - Optical efficacy: 2.5 lm/W - Corrosion Robustness Class: 3B - ESD: 2 kV a

文件：986.22 Kbytes 页数：21 Pages

OSRAM

艾迈斯欧司朗