Inductive Touch Solution for Low-Power HMI Button Applications

文件：1.82078 Mbytes 页数：52 Pages

TI

德州仪器

Inductive Touch Solution for Low-Power HMI and Button Applications

文件：885.55 Kbytes 页数：49 Pages

TI

德州仪器

Package：16-XFBGA，DSBGA；包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 类别：集成电路（IC） ADC/DAC - 特殊用途 描述：IC IND TO DGT CONV 12BIT 16DSBGA

TI2

德州仪器

Inductive Touch Solution for Low-Power HMI and Button Applications

文件：885.55 Kbytes 页数：49 Pages

TI

德州仪器

Inductive Touch Solution for Low-Power HMI Button Applications

文件：1.82078 Mbytes 页数：52 Pages

TI

德州仪器

Single-chip 16/32-bit microcontrollers; 128/256 kB ISP/IAP Flash with 10-bit ADC

General description The LPC2114/LPC2124 are based on a 16/32 bit ARM7TDMI-S™ CPU with real-time emulation and embedded trace support, together with 128/256 kilobytes (kB) of embedded high speed flash memory. A 128-bit wide memory interface and a unique accelerator architecture enable 32-bit cod

文件：161.83 Kbytes 页数：34 Pages

PHI

飞利浦